PatentFIZZ™

1. A modular laser assembly comprising: a laser-fiber housing comprising a semiconductor laser optically coupled to an end of an optical fiber, the laser-fiber housing having electrical leads electrically coupled to the laser and extending from a front face of the laser-fiber housing, wherein the laser-fiber housing is compatible for mounting onto a mating section of a circuit board but is not compatible for mounting onto a mating section of a circuit board designed to mate with a butterfly package housing and wherein the laser-fiber housing is substantially cylindrical; a mounting platform comprising laser interfacing circuitry and contacts electrically coupled thereto, said mounting platform defining a slot for receiving the laser-fiber housing such that a portion of the laser-fiber housing extends to one side of the mounting platform and a portion of the laser-fiber housing extends to an opposite side of the mounting platform, wherein when said laser-fiber housing is mounted to the mounting platform the electrical leads are proximate and capable of being electrically coupled to the contacts on at least a first surface of the mounting platform, and a plurality of pins electrically coupled to said interfacing circuitry and extending laterally from opposing sides of the mounting platform; a temperature-controlling element for coupling to and controlling the temperature of the laser-fiber housing, wherein the temperature-controlling element is configured to be mounted to the laser-fiber housing such that the temperature-controlling element is substantially parallel to and adjacent a second surface of the mounting platform, and wherein the temperature-controlling element includes electrical leads capable of being electrically coupled to contacts on the second surface of the mounting platform; and wherein the dimensions of the mounting platform and the orientation, number, and dimension of the pins extending therefrom, and the dimensions of the laser-fiber housing and the temperature-controlling element are such that the modular laser assembly is compatible for mounting onto a mating section of a circuit board designed to mate with a butterfly package housing.

2. The modular laser assembly of claim 1, wherein the laser-fiber housing is a TO can housing.

3. The modular laser assembly of claim 1, wherein the interfacing circuitry further comprises drive circuitry.

4. The modular laser assembly of claim 1, wherein the pins comprise two parallel sets of seven pins.

5. The modular laser assembly of claim 4, wherein the pins are each approximately 13 mm long and approximately 0.5 mm wide, wherein the pins of each parallel set of seven pins are spaced about 2.5 mm apart.

6. The modular laser assembly of claim 5, wherein the mounting platform is approximately 21 mm long and approximately 13 mm wide.

7. The modular laser assembly of claim 1, wherein the temperature-controlling element is a thermo-electric cooler (TEC).

8. The modular laser assembly of claim 1, wherein: the interfacing circuitry is disposed on the surface of the mounting platform; the laser-fiber housing is substantially cylindrical; and the first and second surfaces are parallel to the pins and the pins extend from opposing end surfaces of the mounting platform that are perpendicular to the first and second surfaces and substantially parallel to the axis of the laser-fiber housing.